We provide reliable foundry access and full tape-out support to bring your design to silicon — securely, efficiently, and on schedule. With more than 100+ successful tape-outs, we ensure your design is submitted securely, efficiently, and in full compliance with foundry requirements. Whether you're developing a custom IC or integrating silicon into a larger system, we provide foundry access with the right technology node, managed from start to finish.
We collaborate directly with major foundries to offer a wide range of technologies, including automotive-qualified, high-voltage, RF, and ultra-low-power processes.
Foundry |
Technologies & Nodes |
CMOS - 55nm, 40nm, 28nm, 22nm, 12nm SiGe – 350nm, 180nm, 130nm, 90nm Mixed Signal / BCD – 180m, 130nm, 55nm, 28nm
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Mixed Signal / BCD – 350nm, 180nm, 130nm, 110nm
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Mixed Signal / BCD – 350nm, 180nm, 110nm SiGe – 350nm
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28FDSOI, P28, B55X, C65LP, C65GP, B9MW, H9A, H9SOI-FEM, BSI 65/40, BSI Stacked SPAD, Silicon Photonics (under condition) |
We manage all technical and logistical aspects of the tape-out submission, including design rule compliance, secure hand-off, and foundry interface.