Presto Engineering operates 4 state-of-the-art test floors and fully equipped reliability and failure analysis labs, representing an investment of over €50 million in advanced equipment. We deliver end-to-end semiconductor test services covering every stage of development and production.
Our engineers specialize in digital, analog, mixed-signal, RF, and millimeter-wave technologies. Their expertise enables fast, accurate, and reliable test development — from wafer probe to final product qualification.
We provide:
Custom semiconductor test program development
Device qualification according to international standards
Automotive-grade testing compliant with AEC-Q100 and ISO requirements
Wafer and package-level testing for ASICs and ICs
Our proven test development flow guarantees consistency, traceability, and the highest production yield.
Presto offers complete semiconductor packaging services designed to meet your chip-to-package co-design requirements. Our packaging experts select and qualify the optimal solution for your project - balancing cost, size, performance, and reliability.
Through long-standing partnerships with leading EDA and OSAT companies, we provide:
Package design and simulation
Assembly and packaging qualification
Thermal and mechanical analysis
Volume manufacturing ramp-up
Our approach ensures seamless integration from design to assembly, delivering robust semiconductor products optimized for performance and manufacturability.
ASIC Design Solutions
Customizable Silicon Platforms
Semiconductor Manufacturing
Test Services
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Foundry Tape-Out Services
