Aerospace Semiconductor Solutions
At Presto Engineering, we develop ASIC and Semiconductor solutions for aerospace applications where reliability, safety, and long-term availability are essential.

Key Challenges in Aerospace Systems
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Extreme reliability requirements
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Long mission lifetimes
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Supply chain robustness
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Qualification complexity
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Environmental constraints: thermal dissipation, vibration resistance and radiation tolerance
Aeronautical systems
In the aeronautics industry, electronic systems must perform safely and predictably, with strict requirements for reliability and certification. Avionic platforms depend on dedicated computing and control systems, each with specific technical constraints that strongly influence ASIC architecture and design.
Presto Engineering supports aircraft manufacturers and equipment suppliers by defining and delivering custom silicon solutions engineered for certified avionics systems.
Engine Control Systems (FADEC)
Responsible for the real-time control and monitoring of aircraft engines.
Key characteristics
- Hard real-time operation with deterministic response
- High redundancy and fault tolerance
- Reliable operation in harsh conditions
- Extended temperature and vibration ranges
- Long service life aligned with aircraft programs
Avionics Display Systems
Provide pilots with critical flight, navigation, and system information through the flight deck interfaces.
Key characteristics
- Real-time graphics and data rendering
- High availability and reliability
- Safety-critical information presentation
- Integration of multiple data sources
- Strict certification constraints
Flight Computer
Responsible for flight control laws, aircraft monitoring, and mission-level functions.
Key characteristics
- Deterministic processing with ultra-low latency
- Redundant, partitioned system architectures
- High integrity with robust fault containment
- Full compliance with avionics safety standards
- Long operational lifetimes
Satellite communications systems
In the aerospace and satellite industry, the terms GEO and LEO refer to different types of Earth orbits, each with specific technical constraints and system requirements that directly impact ASIC design.
Satellite ground stations are the Earth-based infrastructure that enables communication, control, and data exchange between satellites and the ground. They are essential for GEO and LEO missions, as well as for new space constellations. These systems must operate continuously, reliably, and securely while managing increasing data rates, high-frequency RF communications in Ku- and Ka-bands, and complex mission requirements.
Presto Engineering helps customers navigate the trade-offs between GEO, LEO, RF-intensive payloads, and ground segment architectures to define the most effective ASIC solution for their mission.
Geostationary Earth Orbit
Key characteristics
- Continuous coverage over a fixed geographic area
- Long mission lifetimes (often 15–20 years or more)
- High exposure to radiation over time
- Limited opportunities for maintenance or replacement
- Strong requirements for long-term reliability and redundancy
Low Earth Orbit
Key characteristics
- Lower latency and higher bandwidth
- Large satellite constellations allowing inter-satellite communication
- Shorter mission lifetimes compared to GEO
- Higher production volumes
- Frequent launches and replacements
- High-speed data acquisition and transmission
Satellites Ground Station
Key characteristics
- Reliable 24/7 operation with minimal downtime
- Support for increasing bandwidth and fast data transfer
- Low latency requirements
- Ability to handle growing numbers of satellites and ground terminals
- Security and data integrity
ASIC Design for Aerospace & Space Applications
Aerospace systems operate in extreme environments and must comply with stringent standards. By combining deep ASIC design expertise with a strong understanding of aerospace systems, Presto Engineering delivers reliable silicon solutions for mission-critical applications that meet the most demanding requirements, including:
- High reliability and deterministic behavior
- Extended operating temperature ranges
- Radiation-aware and fault-tolerant architectures
- Long product lifecycles and obsolescence control
- Compliance with aerospace standards
Enhanced test solutions (EWS and FT)
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On standard ATE systems
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With customized High-speed/RF front-end modules
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Optimized test program structure for coding complex test sequences
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Comprehensive High-speed and RF test methodology
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High throughput (test time and test coverage)
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Long-term test platform availability
Test Hardware
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Signal integrity for high-speed Digital and high-frequency Analog links testing, including external loopback test strategy
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Power Integrity for high power consumption during test, including power supplies decoupling scheme simulations
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Selection of reliable Probe head and socket technologies to meet high-speed, RF performances, and high-volume test production
Test Software
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Support for defining device DFT
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Test program coding for optimizing the conversion of high evolution patterns, including the compression scheme
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High-speed links protocols compliance, using embedded firmware on
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RF test sequences, including S parameters, Phase noise, and noise figure analysis
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Design Validation (DV) ATE Characterization: Used during R&D to thoroughly test prototypes across their full operating range (extreme temperatures, voltages, loads) to fully characterize performance and refine the design.
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Tri temperature testing capability
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Test time optimization using loopbacks for high-speed & high frequency links
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Multisite consideration from the start to meet the Cost of Test optimization for High-volume production
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Detailed data logging, clear reporting, and full traceability for up to 20 years

Presto Engineering delivers advanced packaging and simulation solutions for SATCOM Ku-/Ka-band applications, ensuring optimal high-frequency performance, thermal management, and space-grade reliability.
Key capabilities
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System-in-Package (SiP) BGA: Integrates multiple ICs (LNA, RF amplifiers, beamforming IC, RF switch, mixers, transceivers) side-by-side or stacked on organic/ceramic substrate
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Thermally Enhanced SiP: Features TIM and metal lid for superior heat dissipation in high-power devices
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Hermetic Packages: Airtight ceramic/metal/glass enclosures protecting against moisture, gases, and contaminants
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Wafer-Level Chip Scale Package (WLCSP): Bare die with RDL, passivation, UBM, and solder balls for compact, high-frequency Ku/Ka-band performance
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Packaging examples: Flip-Chip LGA, Flip-Chip BGA with copper pillars and low-particle trays
Advanced Simulation
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Electrical: Cadence Sigrity/C Clarity 3D for S-parameters, RL/IL/Xtalk, IR drop, SI/PI analysis
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Thermal: Celsius Solver for compact 2R models and complex designs (flip-chip BGA with heat spreader/lid)
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Design Tools: Allegro X for SiP/FCCSP/FOWLP/BGA/LGA layout optimization
Features & Compliance
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REACH/RoHS/CMRT compliant
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Low outgassing (TML/CVCM)
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Radiation tolerant (TID/SEE/DDD)

Presto Engineering offers comprehensive reliability solutions tailored for SATCOM applications, ensuring high-performance ASICs meet stringent space and satellite requirements. These capabilities support the full lifecycle from qualification to production screening.
Key Capabilities
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Extended HTOL Programs
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Individual Temperature Control in HTOL for Devices with High Dissipation or Variation (optimized socket-level thermal management for uniformity)
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Humidity Accelerated Stress Testing (HAST)
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Thermal Cycling & Shock Testing
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Radiation Hardness Assurance
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Hermeticity and Outgassing Package Validation
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Traceability & Data Package Services
Program Includes
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Silicon evaluation during qualification
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Qualification Conformance Inspection for each new manufacturing lot
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100% production screening including Thermal Cycling and Burn-In

Latest technical cases
Discuss your aerospace electronics project
Contact Presto Engineering to discuss how our expertise can support your mission-critical systems with reliable, high-quality silicon.