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Sensor Interface ASIC
Customer need: Sensor Interface ASIC for Advanced Technology
A leading developer of radiation detection solutions based on high-performance sensor materials, the client needed a new Sensor Interface ASIC to reliably interrogate advanced, specialist sensor technology.
The decision to pursue an ASIC development was driven by the need to improve signal integrity, power consumption, device size, and cost efficiency. The project formed part of a government-funded initiative with constrained budget and compressed timescales.
Engineering Solution: From feasibility to Silicon within 12 months
Following an initial feasibility study, we delivered a comprehensive product specification and Statement of Work (SoW) covering chip design, package development, silicon manufacturing, assembly, and production test development.
Through our established partner ecosystem, we introduced the customer to a preferred silicon foundry partner capable of handling both assembly and production testing for the device.
Tape-out was achieved within six months, and within twelve months the customer was evaluating fully functional silicon samples at their end customer's site.
In parallel with the ASIC design, we managed the entire test programme, package customisation, and overall supply chain coordination for the relatively large package.
Business Impact: Turnkey solution for a next-generation Sensor Interface
We delivered a fully managed end-to-end ASIC development process - from initial concept to qualified silicon - providing a complete turnkey solution with integrated supply chain management.
Despite a challenging project schedule, the quality was not compromised. All budget targets were successfully achieved, and the device operated correctly in the target application on first silicon. This enabled the customer to establish a stable, repeatable production flow for volume manufacturing and move forward with the development of the next-generation sensor interface.
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