Presto Engineering to Showcase Turnkey ASIC Design-to-Production Solutions at Embedded World 2024
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Press Release

Presto Engineering to Showcase Turnkey ASIC Design-to-Production Solutions at Embedded World 2024

By Matyas Schegerin, on Mar 19, 2024

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HaiLa Technologies Showcases First Wi-Fi-based Extreme-low-power Backscatter Chip, Developed in Partnership with Presto Engineering
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Press Release

HaiLa Technologies Showcases First Wi-Fi-based Extreme-low-power Backscatter Chip, Developed in Partnership with Presto Engineering

By Matyas Schegerin, on Jan 08, 2024

To be demonstrated at CES 2024, the new BSC2000 device from HaiLa Technologies is the world’s first ...

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Presto Engineering Announces ISO 27001 Certification
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Press Release

Presto Engineering Announces ISO 27001 Certification

By Matyas Schegerin, on Jan 05, 2024

ISO 27001 certification reduces cybersecurity risk and protects all third parties secured assets, ...

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Presto and T&W Engineering Announce Long-Term Partnership to Advance Wearable Brain Sensing
4 min read
Press Release

Presto and T&W Engineering Announce Long-Term Partnership to Advance Wearable Brain Sensing

By Matyas Schegerin, on Nov 02, 2023

Meyreuil, France — November 2, 2023 — Presto Engineering, a European leading expert in ...

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Presto Engineering announces its collaboration with Nokia as part of France 2030 investment plan
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Press Release

Presto Engineering announces its collaboration with Nokia as part of France 2030 investment plan

By Matyas Schegerin, on Oct 05, 2023

Meyreuil, October 5, 2023 - Presto Engineering, a recognized expert in ASIC design and ...

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Presto Engineering expands its collaboration with Integra in North America
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Press Release

Presto Engineering expands its collaboration with Integra in North America

By Matyas Schegerin, on Mar 31, 2022

Silicon Valley, CA, March 31, 2022 - Integra Technologies is pleased to announce the completion of ...

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Presto at @Semicon Europa’s Advanced Packaging Conference in Munich.
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Presto at @Semicon Europa’s Advanced Packaging Conference in Munich.

By Matyas Schegerin, on Nov 04, 2021

On 18 November 2021, Presto’s Claire Patel will be speaking at @Semicon Europa’s Advanced Packaging ...

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Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets
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Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets

By Matyas Schegerin, on Jun 24, 2021

Collaboration Provides Insight on IC Packaging Trends and Delivery of State-of-the-Art IC Package ...

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Presto Engineering Moves to New Facility in Caen for Enhanced Engineering and Production Capabilities
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Press Release

Presto Engineering Moves to New Facility in Caen for Enhanced Engineering and Production Capabilities

By Matyas Schegerin, on Jul 13, 2020

CAEN, France – July 13, 2020 —(BUSINESS WIRE)— Presto Engineering, an ASIC design and outsourced ...

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