Packaging - Presto engineering's experience on substrate design: flip chip BGA

Do you want to discover Presto expertise about substrate design? This technical presentation is made for you!

FLIP CHIP BGA WITH HS 6 SUBSTRATE LAYER 17*17MM, 10GHZ

The chip is designed to target different high-tech markets in the aim to bring more functionalities into today’s systems. Thanks to high processing capabilities, the chip can be integrated in ADAS system to increase the security level of cars. The chip can also be integrated into systems that require fast and high performance image processing, such as autonomous drones, virtual and augmented reality as well as camera control security in private and public areas.

Applications and Targeted Markets

• Advanced Driver, Assistance systems

• Drones: Avoid obstacles and navigate

• Virtual and Augmented Reality

• Video Analytics and Security

Product description

The Packaging technology recommended by Presto Engineering for this chip is lidded fcBGA. The interconnected
technology is Flip Chip using copper pillars in order to guarantee high electrical conductivity. The carrier is a 6 layer
laminate substrate that uses the HDI (High Density Interconnect) technology for lower losses and higher density of copper.
The TIM and Lid attach Materials are carefully selected in order to match the thermal specification as well as the
application requirement. Finally, The Lid design is optimized in order to enhance thermal dissipation and reduce package
warpage.

Design and simulation services

• Analysis bumps, balls coordinates and Netlist

• BOM selection and impedance control

• EDA database: integration of Design rules and electrical constraint

• Routing feasibility and layer count estimation

• Stack-up strategy for optimized Signal and power integrity

• Co-design and I/O assignment, routing completion

• Thermal and I.R Drop simulation for power supply design

• S parameters simulations and package model extraction

A packaging use case

In this ebook, you'll find information about:

• Substrate design

• Thermal Simulation

• DC/IR Drop Simulation

• Frequency domain simulation

• Package Model extraction

• Manufacturing

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