Presto Engineering Tapes Out 2 Macro IPs with X-FAB for Low-Power and High-Precision Sensing Applications

European collaboration strengthens IP catalog with NFC and ADC silicon building blocks

Presto Engineering, a recognized expert in ASIC design and semiconductor services, announced today that it has successfully taped out two advanced (macro) intellectual properties (IPs) in collaboration with X-FAB Silicon Foundries, a leading European foundry. These IPs, comprising an ultra-low power Near Field Communication (NFC) analog front-end with power management and a Sigma-Delta Analog-to-Digital Converter (ADC), are now available in X-FAB’s IP catalog for customers targeting sensing applications in industrial IoT, healthcare, smart packaging, and secure logistics.

“Collaborating with X-FAB through this tape-out reinforces our position as a trusted silicon IP enabler in Europe. We bring robust, silicon-proven IP blocks into the hands of system designers looking for ultra-low power and high-precision ASIC capabilities,” said Cédric Mayor, CEO of Presto Engineering. “These building blocks are part of our broader IP platform strategy to support the development of customers’ ASICs for long battery life and application-specific use cases.”

The tape-outs were completed using X-FAB’s multi-project wafer (MPW) on high-reliability 180nm analog/mixed-signal process, providing an industrial-grade path to volume production. The IPs are available for integration into new ASIC designs, helping reduce risk and development time.

“Partnering with Presto Engineering demonstrates X-FAB’s commitment to delivering advanced, optimized IP solutions for our customers leveraging mature, cost-effective process technologies,” said Ulrich Bretthauer, Product Marketing Manager at
X-FAB. “The tape-out of these two IP blocks on our 180nm node represents a significant milestone in our collaboration, enhancing the European semiconductor ecosystem with expanded IP offerings.”


NFC front-end IP

The NFC front-end IP is fully compliant with ISO/IEC 14443 Type A and includes power management functions for battery-less operation and wireless charging ready, enabling autonomous sensor deployments with sub-1μA standby current for temperature tracking or healthcare monitoring applications.

NFC Macro IP Key Features:

– Fully ISO 14443 Type A compliant analog front-end
– Data rates up to 848 kbps; operating distance up to 10 cm with credit-card antenna
– On-chip energy harvesting, power management and automatic switch between NFC power and 2.7–5.5 V battery
– Standby current < 1 µA
– Suited for cold-chain temperature tags, smart healthcare patches and autonomous sensors

➡️ Link to the leaflet

Sigma-Delta ADC IP

The Sigma-Delta ADC IP delivers exceptional precision (up to 20-bit ENOB at 1 kS/s) with flexible power-performance scaling, ideal for electrochemical measurements, weighing systems, and industrial process control, audio using programmable sample rate.

ADC Macro IP Key Features:

– Sigma-Delta architecture with programmable data rates up to 100 ksps
– Up to 20 bit ENOB at 1 ksps; 17 bit ENOB at 100 ksps
– Integrated PGA (gain up to 64) and anti-aliasing filter
– Configurable Sinc3/Sinc4 digital output filters
– Dual power modes: 40 mW max in high-performance, < 0.5 mW in low-power
– Ideal for precision measurement (weighing scales, electrochemical sensors, industrial process control, audio using programmable sample rate)

➡️ Link to the leaflet

The NFC and ADC IPs are part of Presto’s growing library of silicon-proven building blocks and platforms, developed in Europe and designed for scalable integration into full-custom ASICs. These IP platforms address market needs in:

🩺 Medical wearables & in-vitro diagnostics (IVD)

🛜 Industrial IoT and surveillance systems
📦 Smart packaging and secure logistics

🛣️ Intelligent transportation and mobility

➡️ Learn more about Presto's IP platforms

With in-house test capabilities and partnerships across the semiconductor supply chain, Presto offers customers a full ASIC development and production flow—from specification to tape-out, silicon validation, and volume manufacturing.