Do you want to discover Presto expertise about substrate design? This technical presentation is made for you!
The chip is designed to target different high-tech markets in the aim to bring more functionalities into today’s systems. Thanks to high processing capabilities, the chip can be integrated in ADAS system to increase the security level of cars. The chip can also be integrated into systems that require fast and high performance image processing, such as autonomous drones, virtual and augmented reality as well as camera control security in private and public areas.
Advanced Driver, Assistance systems
Drones: Avoid obstacles and navigate
Virtual and Augmented Reality
Video Analytics and Security
The Packaging technology recommended by Presto Engineering for this chip is lidded fcBGA. The interconnected
technology is Flip Chip using copper pillars in order to guarantee high electrical conductivity. The carrier is a 6 layer
laminate substrate that uses the HDI (High Density Interconnect) technology for lower losses and higher density of copper.
The TIM and Lid attach Materials are carefully selected in order to match the thermal specification as well as the
application requirement. Finally, The Lid design is optimized in order to enhance thermal dissipation and reduce package
warpage.
Analysis bumps, balls coordinates and Netlist
BOM selection and impedance control
EDA database: integration of Design rules and electrical constraint
Routing feasibility and layer count estimation
Stack-up strategy for optimized Signal and power integrity
Co-design and I/O assignment, routing completion
Thermal and I.R Drop simulation for power supply design
S parameters simulations and package model extraction
In this ebook, you'll find information about:
Substrate design
Thermal Simulation
DC/IR Drop Simulation
Frequency domain simulation
Package Model extraction
Manufacturing
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