On 18 November 2021, Presto’s Claire Patel will be speaking at @Semicon Europa’s Advanced Packaging Conference in Munich.
With no two package designs being alike, developing today’s complex semiconductor packages requires experienced engineers, state-of the art facilities as well as a strong network of highly skilled partners in both design and production.
Claire will discuss new packaging challenges for assembly and test of automotive ASICs.
We hope to see you at Semicon Europa!