Advanced circuit analyses techniques require access to the back-side (silicon side) for the device under test (DUT). Except flip-chip, most packages do not permit access to the back-side and require complex and risky de-processing. Additionally, modern packages include connections in the package itself which, when deprocessed, make the device unusable.
Presto Engineering provides three analysis-ready package types which facilitate access to the back-side of the device, while allowing easy and flexible tester loadboard compatibility.
All packages are inverted cavity designs in order to preserve back-side access while socketed on a tester loadboard; all connections are routed in the outer section of the package itself, leaving the device area clear for analysis.
These packages are ready for our standard DUT cards, which connect to any of our testers--so all test and analysis interfaces are standard. This is the first step of a Product Debug project as it gets your device ready for backside techniques. Turn around time is typically 2 weeks.
Even with this fast turn around, this packaging step is best implemented at Registration (as part of our Release Acceleration packages), while most of the preparation work is performed between tape-out and silicon, and can be readily available troughout qualification and validation.
