Design Success Analysis™ Reliability
Our Reliability Lab supports all the stresses required for engineering and product qualification. We execute to all applicable industry standards including JEDEC, AEC and Mil. All of our equipment is regularly calibrated using NIST-traceable tooling and methodology.
Our Reliability services include electrical stresses (ESD and Latch-up); temperature life stresses (Burn-in, both HTOL and LTOL, HTS); and environmental stresses (pre-con/reflow, temp cycle, PCT, HAST). We can accomodate both packages and wafers on most stresses. We also provide design services and fabrication for burn-in boards, HAST boards and ESD adapter boards.
Temperature Life Stresses
| Stress | Specifications |
|---|
| High Temperature Storage Life (HTOL) |
Up to 150°C (Tj)
40 channels, 3GHz
BIB development available
MIL-STD-883 Method 1015.9
JEDEC JESD22-A108
AEC Q100
IEC 60749-23 |
| Low Temperature Storage Life (LTOL) |
Down to -40°C
BIB development available
JEDEC JESD22-A108
IEC 60749-23 |
| Highly accelerated stress test (HAST) |
130°C/85% RH, biased
HAST board development available
JEDEC JESD22-A110
AEC Q100 |
| Temperature humidity biased (THB) |
85°C/85% RH, biased
THB board development available
JEDEC JESD22-A101
AEC Q100 |
Environmental Stresses
| Stress | Specifications |
|---|
| High Temperature Storage Life (HTSL) |
Up to 175°C
JEDEC JESD22-A103
AEC Q100
IEC 60068-2-2 |
| Low Temperature Storage Life (LTSL) |
Down to -40°C
JEDEC JESD22-A103
AEC Q100
IEC 60068-2-2 |
| Preconditioning |
Level 1 (+85°C/85% RH), 2a to 6 Including solder reflow
JEDEC JESD22-A113
IPC/JEDEC J-STD-020 (MSL) |
| Moisture/Reflow Sensitivity Classification (MSLA) |
IPC/JEDEC J-STD-020 (MSL) |
| Temperature cycling (TMCL) |
Up to 165°C - Down to -65°C
JEDEC JESD22-A104
AEC Q100
IEC 60068-2-14
MIL-STD-883 Method 1010.8 |
| Unbiased autoclave (PCT) |
121°C/100% RH
JEDEC JESD22-A 102
AEC Q100 |
| Unbiased HAST (UHAST) |
130°C/85% RH
JEDEC JESD22-A 118
AEC Q100 |
| Temperature humidity unbiased (THNB) |
Up to 85°C/85% RH
JEDEC JESD22-A110
AEC Q100
IEC 60068-2-78 |
| Salt spray |
Up to 50°C/ 0.5 to 3.0 ml per 80 cm2 per hour
ISO 9227
IEC 68-2-11
MIL-STD-810 Method 509,4 |
Electrical Stresses (EOS): ESD/Latch-up/OVS
| Stress | Specifications |
|---|
| HBM |
8kV over 512 pins
ANSI/ESDA/JEDEC-JS-001
MIL-STD-883 Method 3015.8
AEC Q100-002 |
| MM |
2kV over 512 pins
JEDEC JESD22-A115
AEC Q100-003 ESDA ANSI/ESD STM5.2 |
| CDM |
2kV
JEDEC JESD22-C101
ESDA ESD STM5.3
AEC Q100-011 |
| TLP |
500V/10A
ESDA ANSI/ESD STM 5.5.1 |
| IEC system level |
30KV/115A
IEC 61000-4-2 |
| HMM |
30KV/115A
ESDA ANSI/ESD SP 5.6 |
| Latch-up |
1A/50V over 512 pins
Heat up to 150°C
JEDEC JESD78
AEC Q100-004 |
| OVS and PPP |
140V/8A/10MHz
IEC 60134 |
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