Presto Engineering
Services Overview Test Reliability Electrical failure analysis Physical failure analysis Program management

Design Success Analysis™ Reliability

Our Reliability Lab supports all the stresses required for engineering and product qualification. We execute to all applicable industry standards including JEDEC, AEC and Mil. All of our equipment is regularly calibrated using NIST-traceable tooling and methodology.

Our Reliability services include electrical stresses (ESD and Latch-up); temperature life stresses (Burn-in, both HTOL and LTOL, HTS); and environmental stresses (pre-con/reflow, temp cycle, PCT, HAST). We can accomodate both packages and wafers on most stresses. We also provide design services and fabrication for burn-in boards, HAST boards and ESD adapter boards.

Electrical Stresses (ESD/Latch-up)

StressSpecifications
HBM 8kV over 512 pins
Adapter board development available
 JEDEC JESD22-A114E
 MIL-STD-883G Method 3015.7
MM 8kV over 512 pins
Adapter board development available
 JEDEC JESD22-A115-A
 AEC Q100-003 Rev E
 ESDA ANSI/ESD STM5.2
Latch-up 1A/25V over 512 pins
Heat up to 125°C
 JEDEC JESD-78A
CDM 4kV
 ESDA ESD STM5.3-1999

 

Temperature Life Stresses (Burn-in)

StressSpecifications
HTOL up to +125°C, 40 channels, 8MHz
BIB development available
 MIL-STD-883 Method 1015.9
LTOL down to -40°C
HTS Up to 150°C
 JEDEC JESD22-A103-C

 

Environmental Stresses

StressSpecifications
Pre-con Level 1 (+85°C/85% RH), 2a to 6
Including solder reflow
 JEDEC JESD22-A113/J-STD-020C (MSL)
 JEDEC JESD22-A102-C
Reflow  
UBCP/PCT down to -40°
 JEDEC JESD22-A 102-C
Temp cycling +165°C to -65°C (condition C)
 JEDEC JESD22-A104
HAST +130°C/85% RH, biased
HAST board development available
 JEDEC JESD22-A110-B