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Design Success Analysis™ Reliability

Our Reliability Lab supports all the stresses required for engineering and product qualification. We execute to all applicable industry standards including JEDEC, AEC and Mil. All of our equipment is regularly calibrated using NIST-traceable tooling and methodology.
Our Reliability services include electrical stresses (ESD and Latch-up); temperature life stresses (Burn-in, both HTOL and LTOL, HTS); and environmental stresses (pre-con/reflow, temp cycle, PCT, HAST). We can accomodate both packages and wafers on most stresses. We also provide design services and fabrication for burn-in boards, HAST boards and ESD adapter boards.
Electrical Stresses (ESD/Latch-up)
| Stress | Specifications |
| HBM |
8kV over 512 pins Adapter board development available JEDEC JESD22-A114E MIL-STD-883G Method 3015.7 |
| MM |
8kV over 512 pins Adapter board development available JEDEC JESD22-A115-A AEC Q100-003 Rev E ESDA ANSI/ESD STM5.2 |
| Latch-up |
1A/25V over 512 pins Heat up to 125°C JEDEC JESD-78A |
| CDM |
4kV ESDA ESD STM5.3-1999 |
Temperature Life Stresses (Burn-in)
| Stress | Specifications |
| HTOL |
up to +125°C, 40 channels, 8MHz BIB development available MIL-STD-883 Method 1015.9 |
| LTOL |
down to -40°C |
| HTS |
Up to 150°C JEDEC JESD22-A103-C |
Environmental Stresses
| Stress | Specifications |
| Pre-con |
Level 1 (+85°C/85% RH), 2a to 6 Including solder reflow JEDEC JESD22-A113/J-STD-020C (MSL) JEDEC JESD22-A102-C |
| Reflow |
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| UBCP/PCT |
down to -40° JEDEC JESD22-A 102-C |
| Temp cycling |
+165°C to -65°C (condition C) JEDEC JESD22-A104 |
| HAST |
+130°C/85% RH, biased HAST board development available JEDEC JESD22-A110-B |
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