Design Success Analysis™ — Release Acceleration

Modern device analysis and in-silicon techniques
require backside (silicon) access and tester stimulus

Backside (silicon) access and test stimulus demand preparation (typically 4 to 6 weeks): this is no longer a walk-in activity!

We provide a registration program at tape-out that anticipates on subsequent characterization, qualification and analysis needs:

  • Silicon (backside) access, specifically foir wire-bonded devices
  • Test engineering, especially scan-based test programs and solutions
  • Interfaces: loadboard. probe cards, DUT cards;
  • Thermal control solution
  • Database access and preparation for in-silicon navigation

We also provide traditional bring-up capabilities

  • Validation and characterization
  • Reliability, including Soft Error Testing (iRoC Technologies)