We address issues that require in-silicon visibility

We specialize in coupling ATE and in-silicon (failure analysis) tools for dynamic analysis

• With a focus on Scan/DFT test
• With state-of-the-art capabilities for localization and probing
  • Emission for leakage analysis
  • Laser for interconnect analysis
  • E-Beam/probing for in-silicon timing measurements

We are unique in our ability to perform backside analysis

• With proprietary packages for wire-bonded devices
• Extensive experience in sample preparation
• Advance backside FIB capability
• Multiple and comprehensive infra-red analysis technologies