Services Overview Test Reliability Electrical failure analysis Physical failure analysis Program management

Physical Failure Analysis

Our Physical Failure Analysis labs support state-of-the-art techniques for module, and die-level failure analysis, both at the package and wafer levels.

Package-level Analysis:

XRT (1μm spot size @ 160kV)
C-SAM (3D tomography)

Structural Analysis:

FIB (Circuit edit, frontside & backside, Cu & low-k)
Dual-Beam (Cross-section, TEM prep, 8" wafers)
TEM/STEM (0.17nm resolution @ 300kV)
SEM (1.4nm resolution @ 1kV)

Physical Analysis:

SIMS	TXRF	AFM
Auger	XPS	uRaman
FE-AES	Profilometry
VPD-ICP-MS	Ellipsometry