Failure Analysis

Introduction

Presto engineering, through a recognized expertise in Failure analysis, offers more than a list of equipment to its customers.

Thanks to a highly skilled and motivated expert team, we can build up the most relevant failure analysis flow starting from the customer need : yield improvement, design debug, end customer complaint, construction analysis, counterfeit analysis…

 Non-destructive Board/ Package level analysis:

• X-Ray 2D and 3D (Tomography)
• C-SAM (Acoustic tomography)
• IR Thermography
• TDR (Time Domain Reflectometry)

 IC Sample preparation:

• Package Decapsulation :
  • mix of Laser + Mechanical + Chemical opening recipe covering a wide range of package.
  • Specific Copper bonding compatible decapsulation
• Mechanical micro-sections
• Plasma or chemical deprocessing
• Repackaging for IC backside access
• Semi-automatic wirebonding (debug/investigation)

 Electrical Failure analysis:

• Photo Emission microscopy (static and dynamic)
• Laser Stimulation (static and dynamic)
• Electron beam (E-beam) probing
• Mechanical probing (Wafer level and manual micro-probing)

 Physical characterization:

• Optical microscopy
• DHM (Digital Holographic Microscopy)
• SEM (Scaning Electron Microscopy) / EDS (chemical analysis)
• TEM (Transmission Electron Microscopy)
• AFM (Atomic Force Microscopy)
• FIB (Focus Ion Beam) cross-section

 Circuit Edit:

• Laser cut
• FIB edit (backside / frontside)

 Chemical Analysis:

• State of the art equipment available for surface chemical analysis upon request SIMS, Auger, VDP-ICP-MS, XPS, TXRF, uRAMAN.