Dave Bakker has more than 20 years of experience in the semiconductor industry leading key initiatives in defect classification, data analysis and yield management.

Currently, Dave serves as Executive Chairman of Inovys Corp, in Pleasanton, CA. In his career Dave has held positions with KLA-Tencor as Vice President and General Manager and has several published papers and patents in the fields of semiconductor inspection and yield.

Dave also currently has advisory and board positions with Advance Image Science, Finesse, Stratosphere Solutions, ScanR Corp, and Ribbecke Guitar Corp, and is an Affiliate Partner of the Storm Ventures III fund. He also serves on the board of the 501c charity, JazzMasters, and actively mentors graduate engineering students in the Technology Venture Formation Program at Stanford University.

Amir Lev brings more than 20 years of senior executive marketing and senior technical leadership in leading fortune 500 companies including KLA-Tencor and Intel Corporation.

Amir is currently CEO and Co-founder of LS BioPath, a medical device start-up. From 2000 to 2006, he has been Vice President Marketing in several of KLA-Tencor's business (Optical, E-Beam Parametric Metrology group, Wafer inspection group).

Prior to joining KLA-Tencor, Amir has been a senior engineering and R&D manager (as well as quality and reliability manager) at Intel in Israel (Fab8, Fab18), Portland (PTD), Albuquerque (Fab11) and Santa Clara (SCTD).

Amir earned B.Sc and M.Sc degrees in chemical engineering and material science from the Technion, Israel institute of technology Suma cum laude. His technical specialties include Lithography process and equipment, metrology, process control, E-Beam systems, polyimides and spin on glass and yield and reliability management. He has authored several papers and patents related to semiconductor processing and metrology. Amir is a member of SPIE.

Richard J. Ross has over 35 years experience in the semiconductor industry, the most recent 25 in management of a Failure Analysis team at IBM Microelectronics in Essex Junction, Vermont. Prior to his involvement in FA, Dick had management experience in Technology Reliability and Process and Product Development. He also has had engineering experience in Device Characterization/Modeling, Product Engineering, and Circuit Design.

Dick is a founding board member and a past President of the Electronic Devices Failure Analysis Society (EDFAS) and was the 2001 General Chair of the International Symposium for Test and Failure Analysis (ISTFA) and Co-editor of the Fourth Edition of the Microelectronics Failure Analysis Desk Reference.

Dick holds B.S. and M.S. degrees in Electrical Engineering and an M.S. in Engineering Management. He holds two U.S. Patents and has published several articles and regularly teaches tutorials and short courses on the subject of Failure Analysis Lab Management.