Silicon Valley Hub - Reliability

CLICK HERE for a Reliability Request Form



Our Reliability Lab supports all the stresses required for engineering and product qualification. We follow most industry standards including JEDEC, AEC and Mil. All of our equipment are regularly calibrated using NIST-traceable tooling and methodology.


Oryx, ESD, Latch-up, HBM moisture, pre-conditioning HALT

Our Reliability services include electrical stresses (ESD and Latch-up); temperature life stresses (Burn-in, both HTOL and LTOL, HST); and environmental stresses (pre-con/reflow, temp cycle, PCT, HAST). We can accomodate both packages and wafers on most stresses. We also provide BIB, HAST boards and ESD adapter boards.



Electrical Stresses (ESD/Latch-up)

Stress Specifications Equipment
HBM 8kV over 512 pins
Adapter board development available

JEDEC JESD22-A114E
MIL-STD-883G Method 3015.7

Oryx 11000
MM 8kV over 512 pins
Adapter board development available

JEDEC JESD22-A115-A
AEC Q100-003 Rev E
ESDA ANSI/ESD STM5.2

Oryx 11000
Latch-up 1A/25V over 512 pins
Heat up to 125°C

JEDEC JESD-78A

Oryx 11000
CDM 4kV

ESDA ESD STM5.3-1999

Oryx 9000


Temperature Life Stresses (Burn-in)

Stress Specifications Equipment
HTOL up to +125°C, 40 channels, 8MHz
BIB development available

MIL-STD-883 Method 1015.9

Criteria V (x3)
LTOL down to -40°C ThermoDyn. 3212
HTS Up to 150°C

JEDEC JESD22-A103-C

 


Environmental Stresses

Stress Specifications Equipment
Pre-con Level 1 (+85°C/85% RH), 2a to 6
Including solder reflow

JEDEC JESD22-A113/J-STD-020C (MSL)
JEDEC JESD22-A102-C

CSZ ZH-8-1-H
Reflow   Vitronics 500S
UBCP/PCT down to -40°C

JEDEC JESD22-A 102-C

TABAL TPC-410
Temp cycling +165°C to -65°C (condition C)

JEDEC JESD22-A104

ESPEC TSE-11-A
HAST +130°C/85% RH, biased
HAST board development available

JEDEC JESD22-A110-B

ExpressTest
HAST-6000X