CLICK HERE for our NEW Allegheny thermal solution

We provide thermal solutions that permits accurate temperature control while performing in-circuit analysis from the back-side of semiconductor products.

Our thermal solutions are compatible with most commercial emission microscopes, laser scaning miscrocopes, laser voltage probers, time-resolve emission systems and other back-side analysis systems.

We use copper heat spreader for moderate (up to 60W) thermal requirements, and diamond windows for high-end requirements.

As up to 200lbs are applied to the back of the device to socket it, the main challenge of these designs is the trade off between rigidity and reliable thermal connection.

We use finite element analysis (left) to balance rigidity and stress against heat dissipation and temperature control.

Our design are highly modular. Discrete cooling (outer) rings can be used with multiple heat inserts. These inserts can be rotated with 90deg increment for flexibility and full die visibility.

Thermal contact is carefully maintained with spring-loaded shoulder bolts. 20 degree chamfer design is compatible with the use of solid immersion lenses (SIL).

Left is an example (back view) of a diamond-ready heat spreader cooling used by one of our customers to keep a 250+W micro-processor below 70deg while running at full speed, hence allowing dynamic back-side analysis at nominal operation.

We also provide seal plates clamping the design and providing heat convection when alternative ("spray") cooling techniques are used.